Inverse Heat Conduction: Ill-Posed Problems, 2nd edition
Keith A. Woodbury, University of Alabama;
Hamidreza Najafi, Florida Institute of Technology;
Filippo de Monte, University L’Aquila;
James V. Beck, Michigan State University (MSU)
John Wiley & Sons, Inc., 2023
ISBN: 9781119840190;
Language: English
The first edition of the classic book Inverse Heat Conduction: III-Posed Problems, published in 1985, has been used as one of the primary references for researchers and professionals working on IHCPs due to its comprehensive scope and dedication to the topic. The second edition of the book is a largely revised version of the First Edition with several all-new chapters and significant enhancement of the previous material. Over the past 30 years, the authors of this second edition have collaborated on research projects that form the basis for this book, which can serve as an effective textbook for graduate students and as a reliable reference book for professionals. Examples and problems throughout the text reinforce concepts presented.
The second edition continues emphasis from the first edition on linear heat conduction problems with revised presentation of Stolz, Function Specification, and Tikhonov Regularization methods, and expands coverage to include Conjugate Gradient Methods and the Singular Value Decomposition method. The Filter Matrix concept is explained and embraced throughout the presentation and allows any of these solution techniques to be represented in a simple explicit linear form. Two direct approaches suitable for non-linear problems, the Adjoint Method and Kalman Filtering, are presented, as well as an adaptation of the Filter Matrix approach applicable to non-linear heat conduction problems.
In the second edition of Inverse Heat Conduction: III-Posed Problems, readers will find advanced topics, numerous practical examples, and downloadable MATLAB codes.
Inverse Heat Conduction is a must-have resource on the topic for mechanical, aerospace, chemical, biomedical, or metallurgical engineers who are active in the design and analysis of thermal systems within the fields of manufacturing, aerospace, medical, defense, and instrumentation, as well as researchers in the areas of thermal science and computational heat transfer.
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