NPN Bipolar Transistor
NPN bipolar transistor using enhanced Ebers-Moll equations
Libraries:
Simscape /
Electrical /
Semiconductors & Converters
Description
The NPN Bipolar Transistor block uses a variant of the Ebers-Moll equations to represent an NPN bipolar transistor. The Ebers-Moll equations are based on two exponential diodes plus two current-controlled current sources. The NPN Bipolar Transistor block provides the following enhancements to that model:
Early voltage effect
Optional base, collector, and emitter resistances.
Optional fixed base-emitter and base-collector capacitances.
The collector and base currents are:
Where:
IB and IC are base and collector currents, defined as positive into the device.
IS is the saturation current.
VBE is the base-emitter voltage and VBC is the base-collector voltage.
βF is the ideal maximum forward current gain BF
βR is the ideal maximum reverse current gain BR
VA is the forward Early voltage VAF
q is the elementary charge on an electron (1.602176e–19 Coulombs).
k is the Boltzmann constant (1.3806503e–23 J/K).
Tm1 is the transistor temperature, as defined by the Measurement temperature parameter value.
You can specify the transistor behavior using datasheet parameters that the block uses to calculate the parameters for these equations, or you can specify the equation parameters directly.
If qVBC / (kTm1) > 40 or qVBE / (kTm1) > 40, the corresponding exponential terms in the equations are replaced with (qVBC / (kTm1) – 39)e40 and (qVBE / (kTm1) – 39)e40, respectively. This helps prevent numerical issues associated with the steep gradient of the exponential function ex at large values of x. Similarly, if qVBC / (kTm1) < –39 or qVBE / (kTm1) < –39 then the corresponding exponential terms in the equations are replaced with (qVBC / (kTm1) + 40)e–39 and (qVBE / (kTm1) + 40)e–39, respectively.
Optionally, you can specify fixed capacitances across the base-emitter and base-collector junctions. You also have the option to specify base, collector, and emitter connection resistances.
Modeling Temperature Dependence
The default behavior is that dependence on temperature is not modeled, and the device is simulated at the temperature for which you provide block parameters. You can optionally include modeling the dependence of the transistor static behavior on temperature during simulation. Temperature dependence of the junction capacitances is not modeled, this being a much smaller effect.
When including temperature dependence, the transistor defining equations remain the same. The measurement temperature value, Tm1, is replaced with the simulation temperature, Ts. The saturation current, IS, and the forward and reverse gains (βF and βR) become a function of temperature according to the following equations:
where:
Tm1 is the temperature at which the transistor parameters are specified, as defined by the Measurement temperature parameter value.
Ts is the simulation temperature.
ISTm1 is the saturation current at the measurement temperature.
ISTs is the saturation current at the simulation temperature. This is the saturation current value used in the bipolar transistor equations when temperature dependence is modeled.
βFm1 and βRm1 are the forward and reverse gains at the measurement temperature.
βFs and βRs are the forward and reverse gains at the simulation temperature. These are the values used in the bipolar transistor equations when temperature dependence is modeled.
EG is the energy gap for the semiconductor type measured in Joules. The value for silicon is usually taken to be 1.11 eV, where 1 eV is 1.602e-19 Joules.
XTI is the saturation current temperature exponent.
XTB is the forward and reverse gain temperature coefficient.
k is the Boltzmann constant (1.3806503e–23 J/K).
Appropriate values for XTI and EG depend on the type of transistor and the semiconductor material used. In practice, the values of XTI, EG, and XTB need tuning to model the exact behavior of a particular transistor. Some manufacturers quote these tuned values in a SPICE Netlist, and you can read off the appropriate values. Otherwise you can determine values for XTI, EG, and XTB by using a datasheet-defined data at a higher temperature Tm2. The block provides a datasheet parameterization option for this.
You can also tune the values of XTI, EG, and XTB yourself, to match lab data for your particular device. You can use Simulink® Design Optimization™ software to help tune the values.
Thermal Port
You can expose the thermal port to model the effects of generated heat and device temperature. To expose the thermal port, set the Modeling option parameter to either:
No thermal port
— The block does not contain a thermal port and does not simulate heat generation in the device.Show thermal port
— The block contains a thermal port that allows you to model the heat that conduction losses generate. For numerical efficiency, the thermal state does not affect the electrical behavior of the block.
For more information on using thermal ports and on the Thermal Port parameters, see Simulating Thermal Effects in Semiconductors.
Variables
To set the priority and initial target values for the block variables prior to simulation, use the Initial Targets section in the block dialog box or Property Inspector. For more information, see Set Priority and Initial Target for Block Variables.
Nominal values provide a way to specify the expected magnitude of a variable in a model. Using system scaling based on nominal values increases the simulation robustness. Nominal values can come from different sources, one of which is the Nominal Values section in the block dialog box or Property Inspector. For more information, see System Scaling by Nominal Values.
Assumptions and Limitations
The block does not account for temperature-dependent effects on the junction capacitances.
You may need to use nonzero ohmic resistance and junction capacitance values to prevent numerical simulation issues, but the simulation may run faster with these values set to zero.
Ports
Conserving
Parameters
References
[1] G. Massobrio and P. Antognetti. Semiconductor Device Modeling with SPICE. 2nd Edition, McGraw-Hill, 1993.
[2] H. Ahmed and P.J. Spreadbury. Analogue and digital electronics for engineers. 2nd Edition, Cambridge University Press, 1984.